U-PAK BY EXPOCON
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Project : U-PAK BY EXPOCON
Size : 6 x 6 sqm.
Location : BITEC
Budget : 2xx,xxx฿
U-PAK, a leader in pocket-type Carrier Tapes and advanced molding, will feature its latest innovations at NEPCON THAILAND 2025, Southeast Asia's largest electronics manufacturing technology exhibition.
Their booth, built by Smile Exhibit, will highlight U-PAK's brand with a blue and white color scheme and integrated recessed downlights for a bright, modern display.
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